 |
A clear, low viscosity, liquid epoxy adhesive for low temperature industrial bonding in applications where fast curing is required.
Initial bonding occurs in 6-10 minutes @ 77 degrees F. This two component formulation is easily
mixed and is used at room temperature. Since
it contains no solvents, it is suitable for high performance
structural bonding where a combination of very fast cure and low
shrinkage is required. This
liquid adhesive develops strong, tough bonds to wood, metals,
most plastics, epoxy laminates, glass and glass fabrics,
forestry products, ceramics, masonry, marble and other
construction materials. Excellent
for use in the furniture repair trades where fast curing is
required without sacrificing adhesion. |
|
